Department of Electrical Engineering

One quantity of 5 mm square IC in TSMC 180nm G MS RF process

One quantity of 5 mm square IC in TSMC 180nm G MS RF processCORRIGENDUM 1 - EXTENSION OF BID SUBMISSION DATE

One Quantity of 1.2mm x 1.2mm IC in TSMC 65 GP CMOS process

One Quantity of 1.2mm x 1.2mm IC in TSMC 65 GP CMOS process

One Quantity each of 1mm X 1mm, 1.9mm X 1.9mm IC in TSMC 65 GP CMOS process

One Quantity each of 1mm X 1mm, 1.9mm X 1.9mm IC in TSMC 65 GP CMOS process

One Quantity each of 1.3mm x 1.1mm, 1.9mm X 1.1mm IC in TSMC 65 GP CMOS process

One Quantity each of 1.3mm x 1.1mm, 1.9mm X 1.1mm IC in TSMC 65 GP CMOS process

IC tapeout in TSMC65 GP

IC tapeout in TSMC65 GPCORRIGENDUM 1 - EXTENSION OF BID SUBMISSION DATE

Fabrication, BOM procurement and population of a Multiple RF High Power PCB

Fabrication, BOM procurement and population of a Multiple RF High Power PCBCORRIGENDUM 1 - EXTENSION OF BID SUBMISSION DATE

Electromagnetic Emission Test Set up

Electromagnetic Emission Test Set up

SILICON PHOTONIC CHIP TAPE OUT IN SILICON ON INSULATOR PLATFORM

SILICON PHOTONIC CHIP TAPE OUT IN SILICON ON INSULATOR PLATFORM

Pulse Wave Tonometer-Quantity 5

Pulse Wave Tonometer-Quantity 5CORRIGENDUM 1 - EXTENSION OF BID SUBMISSION DATE

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