Plasma enhanced Atomic Layer Deposition (PEALD) system

Plasma enhanced Atomic Layer Deposition (PEALD) system suitable for deposition of Al2O3, AlHfO, AlN, SiO2 and SiN

Submitted by Anonymous on Fri, 2021-02-12 12:37

Plasma enhanced Atomic Layer Deposition (PEALD) system suitable for deposition of Al2O3, AlHfO, AlN, SiO2and SiNCorrigendum 1 - Changes in technical specification & Extension ofBid Submission DateCorrigendum 2 Extension of Bid Submission Date 

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